International company Web Electronic Industry
is taking the candidates in the USA for the position of Local Agent.
We are looking for the trustworthy person with excellent organizational and communicative skills.
Good knowledge of computer and business relations practice will be your advantage.
This is a part-time job which can be combined with any permanent or another part-time job.
Average workload is up to 8 hours a week.
No special experience is necessary. Excellent compensation
package, the salary starts from $20,000 a year.
If you got interested in our vacancy and you have any questions,
please contact us [log in to unmask]
The offer is for USA citizens only.

McGehee makes his solar cells by mixing a titania gel precursor and a special semiconducting polymer, which self-assemble into titania (TiO2) films with polymer-filled pores 20 nm in diameter. Currently, McGehee is still working to improve the efficiency of his solar cells and their resistance to degradation over time in sunlight. "Right now, we're at 2% efficiency, and we want to get to 15%." 15%? That might seem low, but silicon-based cells operate at 12% efficiency, and most importantly, as McGehee points out, "there's a lot of sunlight out there."
A decade ago, Saraswat's research group was the first to begin developing a new kind of chip architecture: the 3-dimensional integrated circuit (3-D IC). Compared to the 2-D planar chips in computers today, 3-D chips can provide the same processing power with a reduced chip surface area. Also, instead of having long, twisting highways of wires, the stacked chips in 3-D ICs allow for short wires much like elevator shafts, as Professor Chidsey puts it-mitigating the problem of delay in the wires. Moreover, 3-D IC architecture allows the integration of all kinds of chips, since chips that require different technologies or materials can be stacked together.
A decade ago, Saraswat's research group was the first to begin developing a new kind of chip architecture: the 3-dimensional integrated circuit (3-D IC). Compared to the 2-D planar chips in computers today, 3-D chips can provide the same processing power with a reduced chip surface area. Also, instead of having long, twisting highways of wires, the stacked chips in 3-D ICs allow for short wires much like elevator shafts, as Professor Chidsey puts it-mitigating the problem of delay in the wires. Moreover, 3-D IC architecture allows the integration of all kinds of chips, since chips that require different technologies or materials can be stacked together.